傳感器和執行器A-物理將多學科的興趣集中在一本雜志上，該雜志專門傳播關于固態傳感器研究和開發的各個方面的信息。傳感器和執行器A：物理部定期向編輯發布原始論文、信件，并在以下設備區域不時邀請評論文章：?基礎和物理，如：效應分類、物理效應、測量理論、傳感器建模、測量標準、測量誤差、單位和常數、時間和頻率測量。建模論文應該把新的建模技術帶到這個領域，并得到實驗結果的支持。?材料及其加工，如：壓電材料、聚合物、金屬氧化物、III-V和II-VI半導體、厚膜和薄膜、光學玻璃纖維、非晶、多晶和單晶硅。?光電傳感器，例如：光伏二極管、光電導體、光電二極管、光電晶體管、正電子敏感光電探測器、光電隔離器、光電二極管陣列、電荷耦合器件、發光二極管、注入激光器和液晶顯示器。?機械傳感器，例如：金屬、薄膜和半導體應變計、擴散硅壓力傳感器、硅加速度計、固態位移傳感器、壓電連接裝置、壓電場效應傳感器（PIFET）、隧道二極管應變傳感器、表面聲波裝置、硅微機械開關，固態流量計和電子流量控制器。?熱傳感器，例如：鉑電阻、熱敏電阻、二極管溫度傳感器、硅晶體管溫度計、集成溫度傳感器、PTAT電路、熱電偶、熱電堆、熱電溫度計、石英溫度計、功率晶體管和厚膜熱打印頭。?磁傳感器，例如：磁電阻、Corbino磁盤、磁二極管、霍爾效應設備、集成霍爾設備、硅耗盡層磁強計、磁注入晶體管、放大鏡、橫向磁晶體管、載流子域磁強計、MOS磁場傳感器、固態讀寫磁頭。?微觀機械，例如：關于執行器、結構、集成傳感器執行器、微系統以及尺寸從毫米到亞微米的其他設備或子設備的研究論文；微觀機電一體化；微電子機械系統；微光機械系統；微機械系統；微機器人；硅和非硅織物操作技術；對微機械感興趣的物理現象的基礎研究；微系統分析；與微機械相關的新課題和材料的探索；與微系統相關的問題，如電源和信號傳輸、與微系統相關的模擬工具；其他微機械感興趣的課題。?接口電子：設計用于直接與上述傳感器接口的電子電路，用于改善或補充這些設備的特性，如線性化、A/D轉換、溫度補償、光強補償、電流/頻率轉換和微機集成。表面處理。?傳感器系統和應用，例如：傳感器總線、多傳感器系統、傳感器網絡、投票系統、遙測、傳感器陣列以及汽車、環境、監測和控制、消費者、醫療、警報和安全、機器人、航海、航空和航天測量系統。

Sensors and Actuators A-Physical brings together multidisciplinary interests in one journal entirely devoted to disseminating information on all aspects of research and development of solid-state devices for transducing physical signals. Sensors and Actuators A: Physical regularly publishes original papers, letters to the Editors and from time to time invited review articles within the following device areas:? Fundamentals and Physics, such as: classification of effects, physical effects, measurement theory, modelling of sensors, measurement standards, measurement errors, units and constants, time and frequency measurement. Modeling papers should bring new modeling techniques to the field and be supported by experimental results.? Materials and their Processing, such as: piezoelectric materials, polymers, metal oxides, III-V and II-VI semiconductors, thick and thin films, optical glass fibres, amorphous, polycrystalline and monocrystalline silicon.? Optoelectronic sensors, such as: photovoltaic diodes, photoconductors, photodiodes, phototransistors, positron-sensitive photodetectors, optoisolators, photodiode arrays, charge-coupled devices, light-emitting diodes, injection lasers and liquid-crystal displays.? Mechanical sensors, such as: metallic, thin-film and semiconductor strain gauges, diffused silicon pressure sensors, silicon accelerometers, solid-state displacement transducers, piezo junction devices, piezoelectric field-effect transducers (PiFETs), tunnel-diode strain sensors, surface acoustic wave devices, silicon micromechanical switches, solid-state flow meters and electronic flow controllers.? Thermal sensors, such as: platinum resistors, thermistors, diode temperature sensors, silicon transistor thermometers, integrated temperature transducers, PTAT circuits, thermocouples, thermopiles, pyroelectric thermometers, quartz thermometers, power transistors and thick-film thermal print heads.? Magnetic sensors, such as: magnetoresistors, Corbino disks, magnetodiodes, Hall-effect devices, integrated Hall devices, silicon depletion-layer magnetometers, magneto-injection transistors, magnistors, lateral magnetotransistors, carrier-domain magnetometers, MOS magnetic-field sensors, solid-state read and write heads.? Micromechanics, such as: research papers on actuators, structures, integrated sensors-actuators, microsystems, and other devices or subdevices ranging in size from millimetres to sub-microns; micromechatronics; microelectromechanical systems; microoptomechanical systems; microchemomechanical systems; microrobots; silicon and non-silicon fabrication techniques; basic studies of physical phenomena of interest to micromechanics; analysis of microsystems; exploration of new topics and materials related to micromechanics; microsystem-related problems like power supplies and signal transmission, microsystem-related simulation tools; other topics of interest to micromechanics.? Interface electronics: electronic circuits which are designed to interface directly with the above transducers and which are used for improving or complementing the characteristics of these devices, such as linearization, A/D conversion, temperature compensation, light-intensity compensation, current/frequency conversion and microcomputer interfacing.? Sensor Systems and Applications, such as: sensor buses, multiple-sensor systems, sensor networks, voting systems, telemetering, sensor arrays, and automotive, environmental, monitoring and control, consumer, medical, alarm and security, robotic, nautical, aeronautical and space measurement systems.