電子包裝雜志發(fā)表論文，使用實驗和理論(分析和計算機輔助)的方法、方法和技術(shù)來解決和解決在電子和光子學(xué)組件、設(shè)備和系統(tǒng)的分析、設(shè)計、制造、測試和操作中遇到的各種機械、材料和可靠性問題。
The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems.
| 影響因子 | h-index | Gold OA文章占比 | 研究類文章占比 | OA開放訪問 | 平均審稿速度 |
| 1.931 | 46 | 1.18% | 90.57% | 未開放 | >12周，或約稿 |
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